Latest 1.6T device with 3.2T test capacity added to EXFO’s hyperscale test tools portfolio including high fiber count solution
QUEBEC CITY, March 16, 2026 — EXFO, the communications industry’s test and measurement experts, today introduced a key device for 1.6T testing, and will demonstrate its comprehensive suite of end-to-end solutions supporting AI-driven hyperscale requirements—including the recently launched high fiber count solution—at the OFC 2026 exhibition opening in Los Angeles tomorrow (EXFO booth #523).
The latest in an impressive lineup of new test solutions is EXFO’s BA-1600-OSFP Bit Error Rate tester, which delivers up to 3.2T test capacity with two independent 1.6T OSFP (octal small form factor pluggable) ports, optimized for cable and transceiver validation.
“EXFO is on a roll delivering the test solutions that hyperscalers, data center operators, and service providers globally need to scale up and keep pace with AI-driven demand,” said Etienne Gagnon, General Manager Test & Measurement at EXFO. “OFC visitors will see—at the EXFO booth and in interoperability demos throughout the show— the positive impact of our advanced testing on fast, accurate, high-speed validation to enable flawless deployments.”
Multicore Fiber Ecosystem Demo
The full multicore fiber ecosystem concept will be evident at Corning Incorporated’s booth (#1739), where Corning and EXFO will demonstrate the ecosystem’s readiness—transporting up to 1.6T of traffic from an integrated 4-core multicore fiber, validating optical loss and connector inspection. Transceiver manufacturers are also partners in the demo which will feature multicore-capable transceivers. Multicore fiber capability will enable customers to further densify data center networks through faster and simpler installation.
Ensuring Co-packaged Optics Ecosystem Readiness
At EXFO’s booth, Corning, GlobalFoundries, and EXFO will showcase a complete ecosystem of emerging co-packaged optics (CPO) technology, which brings fiber connectivity closer to a chip, enabling faster data transmission and higher bandwidth density. From detachable fiber connectivity and high-volume silicon photonics manufacturing to automated die-level testing, customers can now accelerate and scale CPO deployments with confidence.
Industry-wide interoperability demos
EXFO is also participating in interoperability demos with more than 20 other solutions providers and organizations including Ethernet Alliance and OIF.
End-to-end Test Innovations from Chip to System to Data Center
Latest test solutions on the EXFO booth will include:
- Innovative solutions for 1.6T with advanced testing to pave the way for 3.2T
- Automated photonic integrated circuit (PIC) testing—from wafer to die—that accelerates yields and reduces manual steps
- Future-proof, high-speed field solutions up to 400G/800G and coherent that evolve with customers’ networks through simple software upgrades
- Optimized hollow-core fiber testing with our new HCF OTDR test kit
- The industry’s first and most versatile native 24-fiber solution for inside (data center builds) and outside plant (data center interconnect) networks. This new approach comprises new tools that greatly simplify workflows by accelerating Tier-1 and Tier-2 testing in high-fiber-count environments.
EXFO Thought Leadership at OFC
Also at OFC, Guillaume Lavallee, Subject Matter Expert and Optical Instruments Manager at EXFO, will present at the Broadband Forum on March 19 at 2:30 p.m. in Theater 3 at the Los Angeles Convention Center on the topic of “From Connectivity to Intelligence: Evolving Toward a Converged Multi-access Optical PON Network”.
For further details
With AI infrastructure investments accelerating worldwide, EXFO continues to expand its role as a trusted validation partner across the full optical innovation cycle.
To learn more about EXFO’s new BA-1600-OSFP, visit this page.
Find more about EXFO at OFC here.
About EXFO
EXFO develops smarter test, measurement, and monitoring solutions for the global communications industry. We are trusted advisers to network operators, hyperscalers and leaders in the manufacturing, development and research sector. They count on us to deliver superior visibility and insights into network performance, service reliability, and user experience. Building on 40 years of innovation, EXFO’s unique blend of equipment, software and services enable faster, more confident transformations related to 5G, cloud-native, and fiber optic networks.
About Corning Incorporated
Corning (www.corning.com) is one of the world’s leading innovators in materials science, with a 175-year track record of life-changing inventions. Corning applies its unparalleled expertise in glass science, ceramic science, and optical physics, along with its deep manufacturing and engineering capabilities to develop category-defining products that transform industries and enhance people’s lives. Corning succeeds through sustained investment in RD&E, a unique
combination of material and process innovation, and deep, trust-based relationships with customers who are global leaders in their industries. Corning’s capabilities are versatile and
synergistic, which allows the company to evolve to meet changing market needs, while also helping its customers capture new opportunities in dynamic industries. Today, Corning’s markets include optical communications, mobile consumer electronics, display, automotive, solar, semiconductors, and life sciences.
For information:
Shelley Grandy for EXFO
Email: shelley.grandy@exfo.com
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