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Press Release -- March 21st, 2012
Source: Infinera

Infinera Delivers the Terabit Age at SCTE Canadian Summit 2012

Infinera’s DTN-X Platform Displayed on Show Floor SUNNYVALE, CA, Mar 21, 2012 (MARKETWIRE via COMTEX) –Infinera (NASDAQ:INFN, news, filings) announced today its participation next week at the SCTE Canadian Summit. The SCTE Canadian Summit takes place March 27th through 28th at the Toronto Congress Centre, North Building in Toronto, Ontario.

At this year’s Summit, Infinera will showcase Infinera’s DTN-X platform, the industry’s first multi-terabit optical transport solution. At booth #402, Infinera representatives will describe how optical networks based on photonic integration and integrated OTN bandwidth management provide the only cost-effective approach to reducing transport costs per bit today and as networks scale into the Terabit Age.

Infinera’s DTN-X platform is the only optical network solution built using 500 Gb/s photonic integrated circuits (PICs), integrating more than 600 optical functions onto a pair of chips and delivering the world’s first 500 Gb/s FlexCoherent super-channels. Infinera’s DTN-X is designed to work seamlessly with Infinera’s market-leading DTN Digital ROADM and Infinera’s ATN metro edge platform, offering an end-to-end scalable optical transport network from the metro edge through regional networks and across the national backbone.

Infinera’s solutions have been deployed by service providers globally, including major U.S. MSOs in national backbone, regional, and metro applications.

Infinera representatives will be on hand to provide an explanation of the features and capabilities of Infinera’s end-to-end solution. Press and analysts are invited to arrange a meeting by contacting the Infinera representatives below.

About Infinera
Infinera specializes in Digital Optical Networking solutions that are designed to continually improve the economics of optical networking by combining the speed of optics with the simplicity of digital. Infinera is unique in its use of breakthrough semiconductor technology: Large Scale Photonic Integrated Circuit (PIC). Infinera’s platforms leverage PIC technology to provide customers with a service-ready architecture that enables faster time-to-revenue and greater profitability through network efficiency and the ability to rapidly deliver differentiated services without reengineering their optical infrastructure. For more information, please visit

This press release contains forward-looking statements including, among other things, statements relating to the technological and economic benefits of Infinera products now and in the future. These forward looking statements are based on our current expectations. Actual results may vary materially from these expectations as a result of various risks and uncertainties, including, but not limited to, aggressive business tactics by our competitors, our dependence on a single product, our reliance on single-source suppliers, and our ability to respond to rapid technological changes. Further information about these risks and uncertainties, and other risks and uncertainties that affect our business, is contained in the risk factors section and other sections of our annual report on Form 10-K filed with the Securities and Exchange Commission on March 6, 2012, as well subsequent reports filed with or furnished to the SEC. These reports are available on our website at and the SEC’s website at Infinera assumes no obligation to, and does not currently intend to, update any such forward-looking statements.

For media and analysts:

Anna Vue
Tel. (916) 595-8157

Bob Blair
Tel. (408) 716-4879

SOURCE: Infinera

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