Barcelona, Spain, Feb 29, 2012: HiSilicon and Rohde & Schwarz today announced the successful demonstration of DC (dual carriers) and MIMO throughput in HSPA. This marks the world’s first successful demonstration of 84 Mbps WCDMA signals in downlink and 23Mbps in uplink transmission.
Both HiSilicon and Rohde & Schwarz are industry leaders in the development of multi-mode LTE products. They are working together on HiSilicon’s pioneering LTE multi-mode chipset solution Balong 710 and Rohde & Schwarz’s flexible R&S CMW500 multi-standard conformance test platform to enable the wireless industry to certify and deploy LTE/WCDMA technology successfully and more quickly.
Mr Ai Wei, VP of HiSilicon, says: “Balong 710 is proving to be a great step forward for LTE and WCDMA. There is a great deal of talk in the industry about accelerating LTE roadmaps, but in reality there are very few players with a commercially viable LTE multi-mode chipset solution and HiSilicon is one of these companies. Similarly, Rohde & Schwarz was the first supplier on the market with test solutions for LTE, WCDMA and GSM. We are delighted to be working with them on the ongoing development of their comprehensive test case package which meets the industry’s needs for thorough LTE/WCDMA/GSM device testing programs.”
About Rohde & Schwarz
Rohde & Schwarz is an independent group of companies specializing in electronics. It is a leading supplier of solutions in the fields of test and measurement, broadcasting, radiomonitoring and radiolocation as well as secure communications. Established more than 75 years ago, Rohde & Schwarz has a global presence and a dedicated service network in over 70 countries. It has approximately 7,400 employees and achieved a net revenue of € 1.3 billion in fiscal year 2009/2010 (July 2009 to June 2010). The company headquarters are in Munich, Germany.
R&S ® is a registered trademark of Rohde & Schwarz GmbH & Co. KG
HiSilicon Technologies Co., Ltd. is a leading chipset solution provider for telecom network, wireless terminal and digital media. It was formerly known as the ASIC design center of Huawei since 1991 and was spun off in 2004. HiSilicon has the advantage to provide end-to-end chipsets and solutions from telecom network to consumer electronics. It has been serving more than 200 global operators in over 100 countries and will continue to bring maximum value to global operators and consumers. For more information, please visit http://www.hisilicon.com/.